Overview

Ideal For PCB and electronic component manufacturing, these labels are static dissipative and survive extreme processes like wave soldering and multiple harsh washes.

• Engineered to withstand high temperatures
• Low profile, glossy white polyimide material (B-767) features a static dissipative adhesive and liner
• Enhanced topcoat is ideal for boards that go through multiple harsh-condition washes
• Labels do not require reflow or preheatings to ensure printing readability
• Surface resistivity meets ANSI/ESD S541-2008 recommended range for Dissipative ESD packaging materials
• UL Approved; Meets requirements of MIL-STD-202G, Method 215K
• Service temperature of -94 to 212° F (-70 to 100° C)

Specifications

Key Characteristics

Key Characteristics	Article Number	176326
	Order Reference	THT-59-767-10
	Total Qty per Pack	10000 Label(s) / Pack
	Minimum Order Quanitity	1
	QTY. per Row	1
	Application(s)	Circuit board labelling, Component and equipment labelling
	Board Application	After Process, Static Dissipative, Surface Mount Technology (SMT) - Top/Bottom, Through Hole Technology - Bottom, Through Hole Technology - Top
	Quantity	5000
	Brand	Brady®
	Qty per Roll	5000
	Ribbon Series	R6300
	Country of Origin	United States of America
	Country of Origin (SAP)	US

Dimensions

Dimensions	Size - Width (mm)	25.40 mm
	Size - Height (mm)	12.70 mm
	Core - Diameter (mm)	76.20 mm
	Vertical Repeat (mm)	15.24 mm
	Web Width (mm)	30.48 mm
	Dimensions	25.40 mm (W) x 12.70 mm (H)

Material Characteristics

Material Characteristics	Brady Material No.	B-767 (View Technical Data Sheet)
	Brady Material Type	Static Dissipative Polyimide
	Material Properties	Harsh Flux Wash-resistant
	Thickness (mm)	0.104 mm
	Colour	White
	Max. Service Temp. °C	300 °C
	Min. Service Temp. °C	-80 °C
	Adhesive	Static Dissipative Permanent Acrylic
	After Process	Yes, this material will work with this application
	Finish	Gloss
	Performance Characteristics	Abrasion-resistant, Electrostatic dissipative, High heat resistant, Low temperature resistance, Solvent/Chemical resistance
	Surface Mount Technology SMT	Yes, this material will work with this application
	Through Hole Technology	Top: Yes, Bottom: Yes
	Label Properties	Electrostatic Dissipative, Heat Resistant, Permanent Adhesive
	Resistance Properties	Abrasion-resistant, Chalking-resistant, Fluid-resistant, High Temperature-resistant, Impact-resistant, Low Temperature-resistant

Product Features

Product Features	Format (IP)	IP™ Enabled
	Shape	Rectangle

Printing Specifications

Printing Specifications	Print Technology	Thermal Transfer
	Smart Cell	No

Compatibility

Compatibility	Printer Compatibility	A8500, BBP12, BBP81, i5100, i6100, i7100, i7500, IP Series, PR Plus, THT 76 mm Core Printers
	Recommended Ribbon	i75-R6306, IP-R6306, R6306

Preprinted Information

Preprinted Information	Pre-printed Areas on Label	None

Compliance

Compliance	UNSPSC	55121612
	RoHS Compliance Status	Compliant with Directive 2011/65/EU and 2015/863
	REACH SVHC Status	Part does not contain an SVHC
	REACH Candidate List Date	25 June 2025
	Approval/Compliance	ANSI/ESD S541-2008 (between 10 and 10 ohms) for dissipative ESD packaging materials, MIL-STD-202G Method 215K, UL Recognised

Industry Compliance

Industry Compliance	ANSI	ANSI/ESD S541
	MIL-STD	MIL-STD-202G, Method 215K
	UL	UL969