Overview

Static Dissipative Polyimide (B-717) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.

• High temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner
• Surface resistivity values in the recommended range for Dissipative ESD packaging materials as defined by ANSI/ESD S541-2008
• UL Approved;Meets requirements of MIL-STD-202G, Method 215K
• Service temperature of -94 to 212° F (-70 to 100° C)
• Brady Authentic materials work seamlessly with Brady printers for improved printer and material communication, seamless mobile app interaction, and better performance and reliability
• A ribbon is required to print this material. Use Part Number M7-R6000

Specifications

Key Characteristics

Key Characteristics	Minimum Order Quanitity	1
	Article Number	174552
	Order Reference	M7-14-717
	Total Qty per Pack	750 Label(s) / Roll
	QTY. per Row	1
	Application(s)	Circuit board labelling
	Board Application	After Process, Static Dissipative, Surface Mount Technology (SMT) - Top/Bottom, Through Hole Technology - Bottom, Through Hole Technology - Top
	Quantity	750
	Brand	Brady®
	Trade Name	UltraTemp®
	Qty per Roll	750
	Ribbon Series	R6000HF
	Country of Origin	United States of America
	Country of Origin (SAP)	US

Dimensions

Dimensions	Size - Width (mm)	25.40 mm
	Size - Height (mm)	4.75 mm
	Vertical Repeat (mm)	8.26 mm
	Web Width (mm)	33.32 mm
	Dimensions	25.40 mm (W) x 4.75 mm (H)

Material Characteristics

Material Characteristics	Brady Material No.	B-717 (View Technical Data Sheet)
	Brady Material Type	Polyimide
	Material Properties	Harsh Flux Wash-resistant, Static-dissipative
	Thickness (mm)	0.107 mm
	Colour	White
	Max. Service Temp. °C	300 °C
	Min. Service Temp. °C	-70 °C
	Adhesive	Static Dissipative Permanent Acrylic
	After Process	Yes, this material will work with this application
	Finish	Gloss
	Performance Characteristics	Abrasion-resistant, Electrostatic dissipative, High heat resistant, Low temperature resistance, Solvent/Chemical resistance
	Surface Mount Technology SMT	Yes, this material will work with this application
	Through Hole Technology	Top: Yes, Bottom: Yes
	Label Properties	Electrostatic Dissipative, Heat Resistant, Permanent Adhesive
	Resistance Properties	Abrasion-resistant, Chemical-resistant, Fluid-resistant, High Temperature-resistant, Humidity-resistant, Low Temperature-resistant

Product Features

Product Features	Shape	Rectangle

Printing Specifications

Printing Specifications	Print Technology	Thermal Transfer
	Smart Cell	Yes

Compatibility

Compatibility	Printer Compatibility	BMP71, M710
	Recommended Ribbon	M7-R6000

Compliance

Compliance	UNSPSC	55121612
	RoHS Compliance Status	Compliant with Directive 2011/65/EU and 2015/863
	REACH SVHC Status	Part does not contain an SVHC
	REACH Candidate List Date	23 January 2024
	Approval/Compliance	ANSI/ESD S541-2008 (between 10 and 10 ohms) for dissipative ESD packaging materials, MIL-STD-202G Method 215K, UL Recognised

Industry Compliance

Industry Compliance	ANSI	ANSI/ESD S541
	MIL-STD	MIL-STD-202G, Method 215K
	UL	UL969