Static Dissipative Polyimide (B-717) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.

High temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner
Surface resistivity values in the recommended range for Dissipative ESD packaging materials as defined by ANSI/ESD S541-2008
UL Approved;Meets requirements of MIL-STD-202G, Method 215K
Service temperature of -94 to 212° F (-70 to 100° C)
"A ribbon is required to print this material. Use Part Number M61-R6010 for the BMP®61 Label Printer or M71-R6000 for the BMP®71 Label Printer"

Specifications

Key Characteristics


Key Characteristics	Article Number	134241
	Order Reference	PTL-9-717
	Total Qty per Pack	750 Label(s) / Roll
	Minimum Order Quanitity	1
	QTY. per Row	1
	Application(s)	Circuit board labelling
	Quantity	750
	Board Application	After Process, Static Dissipative, Surface Mount Technology (SMT) - Top/Bottom, Through Hole Technology - Bottom, Through Hole Technology - Top
	Brand	Brady®
	Trade Name	UltraTemp®
	Qty per Roll	750
	Ribbon Series	R6000HF
	Additional Information	Static dissipative adhesive
	Country of Origin	MX

Dimensions


Dimensions	Size - Width (mm)	16.51 mm
	Size - Height (mm)	5.08 mm
	Core - Diameter (mm)	25.40 mm
	Vertical Repeat (mm)	8.26 mm
	Web Width (mm)	26.97 mm
	Dimensions	16.51 mm (W) x 5.08 mm (H)

Material Characteristics


Material Characteristics	Brady Material No.	B-717 (View Technical Data Sheet)
	Brady Material Type	Polyimide
	Material Properties	Harsh Flux Wash-resistant, Static-dissipative
	Thickness (mm)	0.107 mm
	Colour	White
	Max. Service Temp. °C	300 °C
	Min. Service Temp. °C	-70 °C
	Adhesive	Static Dissipative Permanent Acrylic
	After Process	Yes, this material will work with this application
	Finish	Gloss
	Performance Characteristics	Abrasion-resistant, Electrostatic dissipative, High heat resistant, Low temperature resistance, Solvent/Chemical resistance
	Surface Mount Technology SMT	Yes, this material will work with this application
	Through Hole Technology	Top: Yes, Bottom: Yes
	Label Properties	Electrostatic Dissipative, Heat Resistant, Permanent Adhesive
	Resistance Properties	Abrasion-resistant, Chemical-resistant, Fluid-resistant, High Temperature-resistant, Humidity-resistant, Low Temperature-resistant

Product Features


Product Features	Shape	Rectangle

Printing Specifications


Printing Specifications	Print Technology	Thermal Transfer
	Smart Cell	Yes

Compatibility


Compatibility	Printer Compatibility	BMP61, BMP71 (with media adapter)
	Recommended Ribbon	M61-R6010, M71-R6000

Compliance


Compliance	UNSPSC	55121612
	RoHS Compliance Status	Compliant with Directive 2011/65/EU and 2015/863
	REACH SVHC Status	Part does not contain an SVHC
	REACH Candidate List Date	17 January 2023
	Approval/Compliance	ANSI/ESD S541-2008 (between 10 and 10 ohms) for dissipative ESD packaging materials, MIL-STD-202G Method 215K, UL Recognised